Publication:

Cost comparison of different TSV implementation options

Date

2016
Proceedings Paper
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dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorJourdain, Anne
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T16:28:48Z
dc.date.available2021-10-23T16:28:48Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27508
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545447/?arnumber=7545447
dc.source.beginpage295
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage301
dc.title

Cost comparison of different TSV implementation options

dc.typeProceedings paper
dspace.entity.typePublication
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