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Conference contributions
Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)
Publication:
Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)
Date
2008-09
Meeting abstract
Simple item page
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17350.pdf
140.1 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Christiaens, Wim
;
Torfs, Tom
;
Huwel, W.
;
Vanfleteren, Jan
Journal
Abstract
Description
Metrics
Views
1906
since deposited on 2021-10-17
400
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations
Metrics
Views
1906
since deposited on 2021-10-17
400
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations