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Conference contributions
Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)
Publication:
Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)
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Date
2008-09
Meeting abstract
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17350.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Christiaens, Wim
;
Torfs, Tom
;
Huwel, W.
;
Vanfleteren, Jan
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Abstract
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1907
since deposited on 2021-10-17
Acq. date: 2025-12-11
Citations
Metrics
Views
1907
since deposited on 2021-10-17
Acq. date: 2025-12-11
Citations