Publication:
Ultrascaled graphene-capped interconnects: a quantum mechanical study
| dc.contributor.author | Reyntjens, Peter | |
| dc.contributor.author | Van de Put, Maarten | |
| dc.contributor.author | Vandenberghe, William G. | |
| dc.contributor.author | Soree, Bart | |
| dc.contributor.imecauthor | Reyntjens, Peter | |
| dc.contributor.imecauthor | Van de Put, Maarten | |
| dc.contributor.imecauthor | Soree, Bart | |
| dc.contributor.orcidimec | Van de Put, Maarten::0000-0001-9179-6443 | |
| dc.contributor.orcidimec | Soree, Bart::0000-0002-4157-1956 | |
| dc.date.accessioned | 2023-10-13T07:55:44Z | |
| dc.date.available | 2023-08-07T17:07:38Z | |
| dc.date.available | 2023-10-13T07:55:44Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2023 | |
| dc.identifier.doi | 10.1109/IITC/MAM57687.2023.10154656 | |
| dc.identifier.eisbn | 979-8-3503-1097-9 | |
| dc.identifier.issn | 2380-632X | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42299 | |
| dc.publisher | IEEE | |
| dc.source.conference | IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM) | |
| dc.source.conferencedate | MAY 22-25, 2023 | |
| dc.source.conferencelocation | Dresden | |
| dc.source.journal | na | |
| dc.source.numberofpages | 3 | |
| dc.subject.keywords | ELECTRICAL-RESISTIVITY MODEL | |
| dc.subject.keywords | POLYCRYSTALLINE FILMS | |
| dc.subject.keywords | REFLECTION | |
| dc.title | Ultrascaled graphene-capped interconnects: a quantum mechanical study | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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