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Metallization for 3D interconnect processing
Publication:
Metallization for 3D interconnect processing
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Date
2012
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Philipsen, Harold
;
Civale, Yann
;
Vandersmissen, Kevin
;
Honore, Mia
;
Inoue, Fumihiro
;
Leunissen, Peter
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1857
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Acq. date: 2025-12-11
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Metrics
Views
1857
since deposited on 2021-10-20
1
last month
Acq. date: 2025-12-11
Citations