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Integration of ball lens in through-package via to enable photonic chip-to-board coupling
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Integration of ball lens in through-package via to enable photonic chip-to-board coupling
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Date
2018
Proceedings Paper
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38429.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Mangal, Nivesh
;
Missinne, Jeroen
;
Van Campenhout, Joris
;
Van Steenberge, Geert
;
Snyder, Brad
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1908
since deposited on 2021-10-25
1
last month
Acq. date: 2025-12-11
Citations