Publication:

Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations

Date

2018
Proceedings Paper
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dc.contributor.authorBertheau, Julien
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorPeng, Lan
dc.contributor.authorIacovo, Serena
dc.contributor.authorRassoul, Nouredine
dc.contributor.authorSleeckx, Erik
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorNakamura, Atsushi
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorRassoul, Nouredine
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecRassoul, Nouredine::0000-0001-9489-3396
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-25T16:43:45Z
dc.date.available2021-10-25T16:43:45Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30241
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/8429534
dc.source.beginpage86
dc.source.conferenceIEEE 68th Electronic Components Technology Conference - ECTC
dc.source.conferencedate29/05/2017
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage91
dc.title

Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations

dc.typeProceedings paper
dspace.entity.typePublication
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