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Using atomic layer deposition to prepare future-generation copper diffusion barriers
Publication:
Using atomic layer deposition to prepare future-generation copper diffusion barriers
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Date
2002
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beyer, Gerald
;
Van Bavel, Mieke
Journal
Micro
Abstract
Description
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1888
since deposited on 2021-10-14
2
last month
Acq. date: 2025-12-16
Citations
Metrics
Views
1888
since deposited on 2021-10-14
2
last month
Acq. date: 2025-12-16
Citations