Publication:
Microlenses on photonic integrated circuits enable flexible packaging and optical isolator integration
| dc.contributor.author | Missinne, Jeroen | |
| dc.contributor.author | Verplancke, Rik | |
| dc.contributor.author | Chang, Yao-Tung | |
| dc.contributor.author | Van Steenberge, Geert | |
| dc.date.accessioned | 2025-05-11T05:42:16Z | |
| dc.date.available | 2025-05-11T05:42:16Z | |
| dc.date.issued | 2025-NOV | |
| dc.description.wosFundingText | This work received funding from the European Union's Horizon 2020 and Horizon Europe innovation program (Grant No. 731954 PIXAPP project; Grant No. 101070178 ADOPTION project) . The authors would also like to thank the cleanroom support staff at CMST for their help with the microlens block fabrication. | |
| dc.identifier.doi | 10.1016/j.optlastec.2025.112940 | |
| dc.identifier.issn | 0030-3992 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45624 | |
| dc.publisher | ELSEVIER SCI LTD | |
| dc.source.journal | OPTICS AND LASER TECHNOLOGY | |
| dc.source.numberofpages | 9 | |
| dc.source.volume | 189 | |
| dc.subject.keywords | MONOLITHIC INTEGRATION | |
| dc.subject.keywords | CHIP | |
| dc.subject.keywords | PROPAGATION | |
| dc.subject.keywords | BACKSIDE | |
| dc.subject.keywords | FIBER | |
| dc.title | Microlenses on photonic integrated circuits enable flexible packaging and optical isolator integration | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |