Publication:

At-speed inter-die interconnect test in 2.5D- and 3D-SICs

Date

2015-10

Proceedings Paper

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Author(s)

Shibin, Konstantin

;

Chickermane, Vivek

;

Keller, Brion

;

Papameletis, Christos

;

Marinissen, Erik Jan

Statistics

1913 since deposited on 2021-10-22

Acq. date: 2026-03-17