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Broadband full-wave BIE impedance characterizaion of 3-D Interconnects

Date

2018
Proceedings Paper
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dc.contributor.authorHuynen, Martijn
dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorVande Ginste, Dries
dc.contributor.imecauthorHuynen, Martijn
dc.contributor.imecauthorDe Zutter, Daniel
dc.contributor.imecauthorVande Ginste, Dries
dc.contributor.orcidimecHuynen, Martijn::0000-0002-5168-9421
dc.contributor.orcidimecVande Ginste, Dries::0000-0002-0178-288X
dc.date.accessioned2021-10-25T20:07:05Z
dc.date.available2021-10-25T20:07:05Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30931
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8534300
dc.source.beginpage241
dc.source.conferenceIEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS
dc.source.conferencedate14/10/2018
dc.source.conferencelocationSan Jose, CA USA
dc.source.endpage243
dc.title

Broadband full-wave BIE impedance characterizaion of 3-D Interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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