Publication:

Variation-aware physics-based electromigration modeling and experimental calibration for VLSI interconnects

Date

2019
Proceedings Paper
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dc.contributor.authorMohanachandran Nair, Sarath
dc.contributor.authorBishnoi, Rajendra
dc.contributor.authorB. Tahoori, Mehdi
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorCroes, Kristof
dc.contributor.authorGarello, Kevin
dc.contributor.authorCatthoor, Francky
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorGarello, Kevin
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.date.accessioned2021-10-27T14:11:00Z
dc.date.available2021-10-27T14:11:00Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33608
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8720559
dc.source.beginpage1
dc.source.conference2019 IEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedate31/03/2019
dc.source.conferencelocationMonterey, CA USA
dc.source.endpage6
dc.title

Variation-aware physics-based electromigration modeling and experimental calibration for VLSI interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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