Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
Publication:
Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
Copy permalink
Date
2018
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
37142.pdf
2.52 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Mangal, Nivesh
;
Missinne, Jeroen
;
Roelkens, Gunther
;
Van Campenhout, Joris
;
Van Steenberge, Geert
;
Snyder, Brad
Journal
Abstract
Description
Metrics
Views
1913
since deposited on 2021-10-25
3
last month
Acq. date: 2025-12-11
Citations
Metrics
Views
1913
since deposited on 2021-10-25
3
last month
Acq. date: 2025-12-11
Citations