Publication:

Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias

Date

2010
Proceedings Paper
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dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorCoenen, Jens
dc.contributor.authorJourdain, Anne
dc.contributor.authorVan Cauwenberghe, Marc
dc.contributor.authorAgarwal, Rahul
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorStucchi, Michele
dc.contributor.authorSoussan, Philippe
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVan Cauwenberghe, Marc
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.date.accessioned2021-10-18T17:16:20Z
dc.date.available2021-10-18T17:16:20Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17299
dc.source.beginpage1083
dc.source.conferenceIEEE 60th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate1/06/2010
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage1087
dc.title

Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias

dc.typeProceedings paper
dspace.entity.typePublication
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