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Conference contributions
Assembly and packaging integration challenges for 3D systems
Publication:
Assembly and packaging integration challenges for 3D systems
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Date
2011
Proceedings Paper
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23911.pdf
2.33 MB
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Swinnen, Bart
Journal
Abstract
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1904
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Acq. date: 2025-12-15
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Views
1904
since deposited on 2021-10-19
1
last month
Acq. date: 2025-12-15
Citations