Publication:

Development of an electroless copper deposition bath for via fill applications on TiN seed layers

Date

1995
Proceedings Paper
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dc.contributor.authorPalmans, Roger
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorMaex, Karen
dc.date.accessioned2021-09-29T13:15:38Z
dc.date.available2021-09-29T13:15:38Z
dc.date.embargo9999-12-31
dc.date.issued1995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/810
dc.source.beginpage87
dc.source.conferenceAdvanced Metallization for ULSI Applications in 1994
dc.source.conferencedate4/10/1994
dc.source.conferencelocationAustin, TX USA
dc.source.endpage94
dc.title

Development of an electroless copper deposition bath for via fill applications on TiN seed layers

dc.typeProceedings paper
dspace.entity.typePublication
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