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Single wafer cleaning and drying: particle removal via a non-contact, non-damaging megasonic clean followed by a high performance "Rotagoni" dry

Date

2000
Proceedings Paper
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dc.contributor.authorLauerhaas, Jeff
dc.contributor.authorMertens, Paul
dc.contributor.authorFyen, Wim
dc.contributor.authorKenis, Karine
dc.contributor.authorMeuris, Marc
dc.contributor.authorNicolosi, T.
dc.contributor.authorBran, M.
dc.contributor.authorFraser, B.
dc.contributor.authorFranklin, C.
dc.contributor.authorWu, Y.
dc.contributor.authorHeyns, Marc
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.accessioned2021-10-14T13:14:34Z
dc.date.available2021-10-14T13:14:34Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4519
dc.source.beginpage157
dc.source.conferenceProceedings of the 9th International Symposium on Semiconductor Manufacturing - ISSM
dc.source.conferencedate26/09/2000
dc.source.conferencelocationTokyo Japan
dc.source.endpage160
dc.title

Single wafer cleaning and drying: particle removal via a non-contact, non-damaging megasonic clean followed by a high performance "Rotagoni" dry

dc.typeProceedings paper
dspace.entity.typePublication
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