Publication:

300 mm wafer development for pattern collapse evaluations

Date

2018
Proceedings Paper
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dc.contributor.authorXu, XiuMei
dc.contributor.authorTao, Zheng
dc.contributor.authorSaib, Mohamed
dc.contributor.authorSebaai, Farid
dc.contributor.authorVan de Kerkhove, Jeroen
dc.contributor.authorVrancken, Nandi
dc.contributor.authorVereecke, Guy
dc.contributor.authorHolsteyns, Frank
dc.contributor.imecauthorXu, XiuMei
dc.contributor.imecauthorTao, Zheng
dc.contributor.imecauthorSaib, Mohamed
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorVan de Kerkhove, Jeroen
dc.contributor.imecauthorVrancken, Nandi
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecXu, XiuMei::0000-0002-3356-8693
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-26T09:59:46Z
dc.date.available2021-10-26T09:59:46Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32314
dc.identifier.urlhttps://www.scientific.net/SSP.282.207
dc.source.beginpage207
dc.source.conferenceUltra Clean Processing of Semiconductor Surfaces XIV - UCPSS
dc.source.conferencedate3/09/2018
dc.source.conferencelocationLeuven Belgium
dc.source.endpage210
dc.title

300 mm wafer development for pattern collapse evaluations

dc.typeProceedings paper
dspace.entity.typePublication
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