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Conference contributions
Metal-barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by surfactant residues
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Metal-barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by surfactant residues
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Date
2018
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39151.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Krishtab, Mikhail
;
de Marneffe, Jean-Francois
;
Armini, Silvia
;
Wilson, Chris
;
De Gendt, Stefan
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1831
since deposited on 2021-10-25
1
last month
Acq. date: 2025-12-16
Citations