Publication:

Failure and stress analysis of Cu TSVs using

Date

2015
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorKhaled, Ahmad
dc.contributor.authorHerms, Martin
dc.contributor.authorWagner, Matthias
dc.contributor.authorDjuric, Tatjana
dc.contributor.authorCzurratis, Peter
dc.contributor.authorBrand, Sebastian
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.date.accessioned2021-10-22T18:53:37Z
dc.date.available2021-10-22T18:53:37Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25160
dc.source.beginpage119
dc.source.conference41st International Symposium for Testing and Failure Analysis - ISTFA
dc.source.conferencedate1/11/2015
dc.source.conferencelocationPortland USA
dc.source.endpage25
dc.title

Failure and stress analysis of Cu TSVs using

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions