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Comparison of electrical properties of thermo-compression bonded 3D stacks using a liquid and a dry-film wafer level underfills

Date

2015
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dc.contributor.authorDuval, Fabrice
dc.contributor.authorWang, Teng
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorGerets, Carine
dc.contributor.authorMiller, Andy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T19:08:13Z
dc.date.available2021-10-22T19:08:13Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25238
dc.source.conference17th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate2/12/2015
dc.source.conferencelocationSingapore Singapore
dc.title

Comparison of electrical properties of thermo-compression bonded 3D stacks using a liquid and a dry-film wafer level underfills

dc.typeMeeting abstract
dspace.entity.typePublication
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