Publication:
Electro-Opto-Thermal Dynamic Compact Model for Ring Modulator Arrays
| dc.contributor.author | Coenen, David | |
| dc.contributor.author | Kim, Minkyu | |
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.imecauthor | Coenen, David | |
| dc.contributor.imecauthor | Kim, Minkyu | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.orcidimec | Coenen, David::0000-0002-3732-1874 | |
| dc.contributor.orcidimec | Kim, Minkyu::0000-0002-8999-2303 | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.date.accessioned | 2025-05-17T05:45:22Z | |
| dc.date.available | 2025-05-17T05:45:22Z | |
| dc.date.issued | 2025-MAY | |
| dc.description.wosFundingText | This work was supported by Imec's Expertise Center Advanced Reliability, Robustness and Test (AR2T). | |
| dc.identifier.doi | 10.1109/TCPMT.2024.3489803 | |
| dc.identifier.issn | 2156-3950 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45681 | |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | |
| dc.source.beginpage | 1006 | |
| dc.source.endpage | 1013 | |
| dc.source.issue | 5 | |
| dc.source.journal | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | |
| dc.source.numberofpages | 8 | |
| dc.source.volume | 15 | |
| dc.title | Electro-Opto-Thermal Dynamic Compact Model for Ring Modulator Arrays | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |