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Study of void formation kinetics in cu interconnects using local sense structures

Date

2011
Proceedings Paper
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dc.contributor.authorCroes, Kristof
dc.contributor.authorLofrano, Melina
dc.contributor.authorWilson, Chris
dc.contributor.authorCarbonell, Laure
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-19T12:58:56Z
dc.date.available2021-10-19T12:58:56Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18752
dc.source.beginpage321
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate10/04/2011
dc.source.conferencelocationMonterey, CA USA
dc.source.endpage327
dc.title

Study of void formation kinetics in cu interconnects using local sense structures

dc.typeProceedings paper
dspace.entity.typePublication
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