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Early fatigue failures in copper wire bonds inside packages with low CTE green mold compounds
Publication:
Early fatigue failures in copper wire bonds inside packages with low CTE green mold compounds
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Date
2012
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Willems, Geert
Journal
Abstract
Description
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2023
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Acq. date: 2025-12-15
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Views
2023
since deposited on 2021-10-20
1
last month
Acq. date: 2025-12-15
Citations