High frequency modelling of on-chip interconnects considering conductor and substrate skin effects

dc.contributor.author	Ymeri, H.
dc.contributor.author	Nauwelaers, Bart
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Nauwelaers, Bart
dc.contributor.imecauthor	Maex, Karen
dc.date.accessioned	2021-10-15T18:10:41Z
dc.date.available	2021-10-15T18:10:41Z
dc.date.embargo	9999-12-31
dc.date.issued	2004
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/9964
dc.source.beginpage	35
dc.source.endpage	38
dc.source.issue	1
dc.source.journal	Microelectronics International
dc.source.volume	21
dc.title	High frequency modelling of on-chip interconnects considering conductor and substrate skin effects
dc.type	Journal article
dspace.entity.type	Publication
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