Browsing imec Publications by author "Zahedmanesh, Houman"
Now showing items 61-65 of 65
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Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits
Okudur, Oguzhan Orkut; De Messemaeker, Joke; Salahouelhadj, Abdellah; Gonzalez, Mario; Zahedmanesh, Houman; Varela Pedreira, Olalla; Kim, Soon-Wook; Vanstreels, Kris; Beyne, Eric; De Wolf, Ingrid (2017) -
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters
Ding, Youqi; Varela Pedreira, Olalla; Lofrano, Melina; Zahedmanesh, Houman; Chavez, T.; Farr, H.; De Wolf, Ingrid; Croes, Kristof (2023) -
Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM
Mayahinia, Mahta; Tahoori, Mehdi; Perumkunnil, Manu; Zahedmanesh, Houman; Croes, Kristof; Marinelli, Tommaso; Gomez Perez, Jose Ignacio; Evenblij, Timon; Kar, Gouri Sankar; Catthoor, Francky (2022) -
Variation-aware physics-based electromigration modeling and experimental calibration for VLSI interconnects
Mohanachandran Nair, Sarath; Bishnoi, Rajendra; B. Tahoori, Mehdi; Zahedmanesh, Houman; Croes, Kristof; Garello, Kevin; Catthoor, Francky (2019) -
Void-dynamics in nano-wires and the role of microstructure investigated via a multi-scale physics-based model
Saleh, Ali; Ceric, H.; Zahedmanesh, Houman (2021)