Recently added

A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards

Marinissen, Erik Jan; Fodor, Ferenc; De Wachter, Bart; Kiesewetter, Joerg; Hill, Eric; Smith, Ken (2017-09)

Test and design-for-test of 3D-stacked ICs

Marinissen, Erik Jan (2017-12)

Testing of 2.5D- and 3D-stacked integrated circuits

Marinissen, Erik Jan (2017-09)

3D IC stacking: Do-It-Yourself short course

Marinissen, Erik Jan (2017-08)

Fundamentals of Ge1-xSnx and SiyGe1-x-ySnx RPCVD epitaxy

Margetis, Joe; Mosleh, Aboozar; Ghetmiri, Seyed Amir; Al-Kabi, Sattar; Dou, Wei; Du, Wei; Bhargava, Nupur; Yu, Shui-Qing; Profijt, Harald; Kohen, David; Loo, Roger; Vohra, Anurag; Tolle, John (2017)

Steering the properties of MoOX hole transporting layers in OPV's and OLED's: Interface morphology vs. electronic structure

Marchal, Wouter; Verboven, Inge; Kesters, Jurgen; Moeremans, Boaz; De Dobbelaere, Christopher; Bonneux, Gilles; Elen, Ken; Conings, Bert; Maes, Wouter; Boyen, Hans-Gerd; Deferme, Wim; Van Bael, Marlies; Hardy, An (2017)

Ultrasonically spray-coated silver layers from designed precursor inks for flexible electronics

Marchal, Wouter; Vandevenne, Glen; D'Haen, Jan; Calmont Andrade Almeda, A.; Durant Sola jr, M. Antonio; Van den Ham, Jonathan; Drijkoningen, Jeroen; Elen, Ken; Deferme, Wim; Van Bael, Marlies; Hardy, An (2017)

Modal analysis based equivalent circuit model and its verification for a single cMUT cell

Mao, Shengping; Rottenberg, Xavier; Rochus, Veronique; Czarnecki, Piotr; Helin, Philippe; Severi, Simone; Nauwelaers, Bart; Tilmans, Harrie (2017)

Micromachined Ultrasonic Transducers for Acoustic Manipulation

Mao, Shengping (2017-09)

Spin on metal oxide materials for N7 and beyond patterning applications

Mannaert, Geert; Altamirano Sanchez, Efrain; Hopf, Toby; Sebaai, Farid; Lorant, Christophe; Petermann, Claire; Hong, S-E; Mullen, S; Wolfer, E; Mckenzie, D; Yao, H; Rahman, D; Cho, J-Y; Padmanaban, M; Piumi, Daniele (2017)

A bottom-up energy simulation framework to accurately compare PV module topologies under non-uniform and dynamic operating conditions

Manganiello, Patrizio; Baka, Maro; Goverde, Hans; Borgers, Tom; Govaerts, Jonathan; van der Heide, Arvid; Voroshazi, Eszter; Catthoor, Francky (2017)

Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

Mangal, Nivesh; Missinne, Jeroen; Van Steenberge, Geert; Van Campenhout, Joris; Snyder, Brad (2017)

Interconnected MTJs driven by STT for spin-logic applications

Manfrini, Mauricio; Vaysset, Adrien; Wan, Danny; Raymenants, Eline; Swerts, Johan; Rao, Siddharth; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Cupak, Miroslav; Dehan, M; Sayan, S; Nikonov, D.E.; Manipatruni, S; Young, I. A.; Mocuta, Dan; Radu, Iuliana (2017)

A perturbative approach to predict eye diagram degradation in differential interconnects subject to asymmetry and nonuniformity

Manfredi, Paolo; Wu, Xinglong; Grassi, Flavia; Vande Ginste, Dries; Pignari, Sergio A. (2017)

Worst-case EMC investigation of single-wire transmission lines based on Taylor arithmetic

Manfredi, Paolo; Trinchero, R.; Stievano, S. (2017-08)

The impact of sequential-3D integration on semiconductor scaling roadmap

Mallik, Arindam; Vandooren, Anne; Witters, Liesbeth; Walke, Amey; Franco, Jacopo; Sherazi, Yasser; Weckx, Pieter; Yakimets, Dmitry; Garcia Bardon, Marie; Parvais, Bertrand; Debacker, Peter; Ku, B.W.; Lim, S.K.; Mocuta, Anda; Mocuta, Dan; Ryckaert, Julien; Collaert, Nadine; Raghavan, Praveen (2017)

Design-technology co-optimization for OxRRAM-based synaptic processing unit

Mallik, Arindam; Garbin, Daniele; Fantini, Andrea; Rodopoulos, Dimitrios; Degraeve, Robin; Stuijt, Jan; Das, Anup Kumar; Schaafsma, Siebren; Debacker, Peter; Donadio, Gabriele Luca; Hody, Hubert; Goux, Ludovic; Kar, Gouri Sankar; Furnemont, Arnaud; Mocuta, Anda; Raghavan, Praveen (2017)

imec Publications: Recent submissions

A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards

Test and design-for-test of 3D-stacked ICs

Testing of 2.5D- and 3D-stacked integrated circuits

3D IC stacking: Do-It-Yourself short course

Fundamentals of Ge1-xSnx and SiyGe1-x-ySnx RPCVD epitaxy

Steering the properties of MoOX hole transporting layers in OPV's and OLED's: Interface morphology vs. electronic structure

Ultrasonically spray-coated silver layers from designed precursor inks for flexible electronics

Modal analysis based equivalent circuit model and its verification for a single cMUT cell

Micromachined Ultrasonic Transducers for Acoustic Manipulation

Spin on metal oxide materials for N7 and beyond patterning applications

A bottom-up energy simulation framework to accurately compare PV module topologies under non-uniform and dynamic operating conditions

Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

Interconnected MTJs driven by STT for spin-logic applications

A perturbative approach to predict eye diagram degradation in differential interconnects subject to asymmetry and nonuniformity

Worst-case EMC investigation of single-wire transmission lines based on Taylor arithmetic

The impact of sequential-3D integration on semiconductor scaling roadmap

Design-technology co-optimization for OxRRAM-based synaptic processing unit

Photolithography as enabler of AMOLED displays beyond 1000 ppi

Monolithic near infrared image sensors enabled by quantum dot photodetector

SWIR detection with thin-film photodetectors based on colloidal quantum dots

imec Publications: Recent submissions

A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards ﻿

Test and design-for-test of 3D-stacked ICs ﻿

Testing of 2.5D- and 3D-stacked integrated circuits ﻿

3D IC stacking: Do-It-Yourself short course ﻿

Fundamentals of Ge1-xSnx and SiyGe1-x-ySnx RPCVD epitaxy ﻿

Steering the properties of MoOX hole transporting layers in OPV's and OLED's: Interface morphology vs. electronic structure ﻿

Ultrasonically spray-coated silver layers from designed precursor inks for flexible electronics ﻿

Modal analysis based equivalent circuit model and its verification for a single cMUT cell ﻿

Micromachined Ultrasonic Transducers for Acoustic Manipulation ﻿

Spin on metal oxide materials for N7 and beyond patterning applications ﻿

A bottom-up energy simulation framework to accurately compare PV module topologies under non-uniform and dynamic operating conditions ﻿

Packaging silicon photonics with polymer waveguides for 3D electro-optical integration ﻿

Interconnected MTJs driven by STT for spin-logic applications ﻿

A perturbative approach to predict eye diagram degradation in differential interconnects subject to asymmetry and nonuniformity ﻿

Worst-case EMC investigation of single-wire transmission lines based on Taylor arithmetic ﻿

The impact of sequential-3D integration on semiconductor scaling roadmap ﻿

Design-technology co-optimization for OxRRAM-based synaptic processing unit ﻿

Photolithography as enabler of AMOLED displays beyond 1000 ppi ﻿

Monolithic near infrared image sensors enabled by quantum dot photodetector ﻿

SWIR detection with thin-film photodetectors based on colloidal quantum dots ﻿

A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards

Test and design-for-test of 3D-stacked ICs

Testing of 2.5D- and 3D-stacked integrated circuits

3D IC stacking: Do-It-Yourself short course

Fundamentals of Ge1-xSnx and SiyGe1-x-ySnx RPCVD epitaxy

Steering the properties of MoOX hole transporting layers in OPV's and OLED's: Interface morphology vs. electronic structure

Ultrasonically spray-coated silver layers from designed precursor inks for flexible electronics

Modal analysis based equivalent circuit model and its verification for a single cMUT cell

Micromachined Ultrasonic Transducers for Acoustic Manipulation

Spin on metal oxide materials for N7 and beyond patterning applications

A bottom-up energy simulation framework to accurately compare PV module topologies under non-uniform and dynamic operating conditions

Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

Interconnected MTJs driven by STT for spin-logic applications

A perturbative approach to predict eye diagram degradation in differential interconnects subject to asymmetry and nonuniformity

Worst-case EMC investigation of single-wire transmission lines based on Taylor arithmetic

The impact of sequential-3D integration on semiconductor scaling roadmap

Design-technology co-optimization for OxRRAM-based synaptic processing unit

Photolithography as enabler of AMOLED displays beyond 1000 ppi

Monolithic near infrared image sensors enabled by quantum dot photodetector

SWIR detection with thin-film photodetectors based on colloidal quantum dots