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Conference contributions
RIE dynamics for extreme wafer thinning applications
Publication:
RIE dynamics for extreme wafer thinning applications
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Date
2017
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Rassoul, Nouredine
;
Jourdain, Anne
;
Tutunjyan, Nina
;
De Vos, Joeri
;
Sardo, Stefano
;
Inoue, Fumihiro
;
Piumi, Daniele
;
Miller, Andy
;
Beyne, Eric
;
Walsby, Edward
;
Jash Patel, Patel
;
Oliver, Ansell
;
Huma, Ashraf
;
Janet, Hopkins
;
Dave, Thomas
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2075
since deposited on 2021-10-24
Acq. date: 2025-12-15
Citations
Metrics
Views
2075
since deposited on 2021-10-24
Acq. date: 2025-12-15
Citations