Publication:

RIE dynamics for extreme wafer thinning applications

Date

2017
Meeting abstract
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dc.contributor.authorRassoul, Nouredine
dc.contributor.authorJourdain, Anne
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorSardo, Stefano
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPiumi, Daniele
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorWalsby, Edward
dc.contributor.authorJash Patel, Patel
dc.contributor.authorOliver, Ansell
dc.contributor.authorHuma, Ashraf
dc.contributor.authorJanet, Hopkins
dc.contributor.authorDave, Thomas
dc.contributor.imecauthorRassoul, Nouredine
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorSardo, Stefano
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPiumi, Daniele
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorWalsby, Edward
dc.contributor.orcidimecRassoul, Nouredine::0000-0001-9489-3396
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecSardo, Stefano::0000-0002-9302-8007
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-24T11:55:21Z
dc.date.available2021-10-24T11:55:21Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29271
dc.source.conferencePESM
dc.source.conferencedate20/10/2017
dc.source.conferencelocationLeuven Belgium
dc.title

RIE dynamics for extreme wafer thinning applications

dc.typeMeeting abstract
dspace.entity.typePublication
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