Recently added

Study of SiGe cleaning

Komori, Kana; Wostyn, Kurt; Rondas, Dirk; Loyo Prado, Jana; Conard, Thierry; Loo, Roger; Ragnarsson, Lars-Ake; Horiguchi, Naoto; Holsteyns, Frank (2017)

LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration

Kocaay, Deniz; Roussel, Philippe; Croes, Kristof; Ciofi, Ivan; Saad, Yves; De Wolf, Ingrid (2017)

Synthesis of degradable polymers for biomedical applications

Kobben, Stephan (2017-06)

Indoor tracking of multiple persons with a 77 GHz MIMO FMCW radar

Knudde, Nicolas; Vandersmissen, Baptist; Parashar, Karthick; Couckuyt, Ivo; Jalalvand, Azarakhsh; Bourdoux, André; De Neve, Wesley; Dhaene, Tom (2017)

GPflowOpt: A bayesian optimization library using tensorflow

Knudde, Nicolas; van der Herten, Joachim; Dhaene, Tom; Couckuyt, Ivo (2017-12)

Thickness and gas permeability properties of PLA and PLA/EVOH/PLA before and after thermoforming into variable tray types

Knockaert, Griet; Houben, Levy; Adons, Dimitri; Carleer, Robert; Yperman, Jan; Peeters, Roos; Buntinx, Mieke (2017)

Geïntegreerd STEM-onderwijs in de praktijk

Knipprath, Heidi; De Meester, Jolien; De Cock, Mieke; Boeve-de-Pauw, jelle; Ceuppens, Stijn; Dehaene, Wim; De Loof, Hayden; Depaepe, Fien; Goovaerts, Leen; Hellinckx, Luc; Struyf, Annemie; Thibaut, Lieve; van de Velde, Didier; van Petegem, Peter (2017)

Integrated STEM makes a difference!

Knipprath, Heidi; De Meester, Jolien; Bouve-de-Pauw, Jelle; Ceuppens, Stijn; De Cock, Mieke; Dehaene, Wim; De Loof, Haydee; Depaepe, Fien; Goovaerts, Leen; Hellinckx, Luc; Struyf, Annemie; Thibaut, Lieve; Van de Velde, Didier; Van Petegem, Peter (2017)

How social, natural and applied scientists collide and connect: a story about interdisciplinarity put into practice in Flemish schools

Knipprath, Heidi; Boeve-de-Pauw, Jelle; Ceuppens, Stijn; De Cock, Mieke; Dehaene, Wim; De Loof, Haydée; De Meester, Jolien; Depaepe, Fien; Goovaerts, Leen; Hellinckx, Luc; Struyf, Annemie; Thibaut, Lieve; van de Velde, Didier; Van Petegem, Peter (2017)

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2017)

Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction Loading

Kljucar, Luka (2017-12)

How do student and classroom characteristics affect attitude toward mathematics? A multivariate multilevel analysis

Kiwanuka, Henry Nsubuga; Van Damme, Jan; Van den Noortgate, Wim; Anumendem, Dickson Nkafu; Vanlaar, Gudrun; Reynolds, Chandra; Namusisi, Speranza (2017)

Distinctive behavior of perpendicular magnetic tunnel junctions with size comparable to the electrical switching nucleation

Kim, Woojin; Rao, Siddharth; Van Beek, Simon; Garello, Kevin; Couet, Sebastien; Swerts, Johan; Mertens, Sofie; Lin, Tsann; Souriau, Laurent; Kundu, Shreya; Tsvetanova, Diana; Donadio, Gabriele Luca; Yasin, Farrukh; Sakhare, Sushil; Furnemont, Arnaud; Kar, Gouri Sankar (2017)

In-line 3D AFM for critical dimension and sidewall roughness of Si photonic waveguide and correlation with its propagation loss

Kim, Tae-Gon; Verheyen, Peter; De Heyn, Peter; Vandeweyer, Tom; Miller, Andy; Pantouvaki, Marianna; Van Campenhout, Joris; Jo, Ahjin; Cho, Sangjoon; Park, Sang-il (2017)

imec Publications: Recent submissions

Study of SiGe cleaning

LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration

Synthesis of degradable polymers for biomedical applications

Indoor tracking of multiple persons with a 77 GHz MIMO FMCW radar

GPflowOpt: A bayesian optimization library using tensorflow

Thickness and gas permeability properties of PLA and PLA/EVOH/PLA before and after thermoforming into variable tray types

Geïntegreerd STEM-onderwijs in de praktijk

Integrated STEM makes a difference!

How social, natural and applied scientists collide and connect: a story about interdisciplinarity put into practice in Flemish schools

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction Loading

How do student and classroom characteristics affect attitude toward mathematics? A multivariate multilevel analysis

Distinctive behavior of perpendicular magnetic tunnel junctions with size comparable to the electrical switching nucleation

In-line 3D AFM for critical dimension and sidewall roughness of Si photonic waveguide and correlation with its propagation loss

In-line metrology for atomic resolution local height variation

In-line atomic resolution local nanotopography variation metrology for CMP process

Design and pitch scaling for affordable node transition and EUV insertion scenario

EUV single patterning for logic metal layers: achievement and challenge

650 V dispersion-free enhancement-mode GaN-on-Si HEMTs processed in a 200 mm CMOS fab

STBC: Side channel attack tolerant balanced circuit with reduced propagation delay

imec Publications: Recent submissions

Study of SiGe cleaning ﻿

LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration ﻿

Synthesis of degradable polymers for biomedical applications ﻿

Indoor tracking of multiple persons with a 77 GHz MIMO FMCW radar ﻿

GPflowOpt: A bayesian optimization library using tensorflow ﻿

Thickness and gas permeability properties of PLA and PLA/EVOH/PLA before and after thermoforming into variable tray types ﻿

Geïntegreerd STEM-onderwijs in de praktijk ﻿

Integrated STEM makes a difference! ﻿

How social, natural and applied scientists collide and connect: a story about interdisciplinarity put into practice in Flemish schools ﻿

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects ﻿

Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction Loading ﻿

How do student and classroom characteristics affect attitude toward mathematics? A multivariate multilevel analysis ﻿

Distinctive behavior of perpendicular magnetic tunnel junctions with size comparable to the electrical switching nucleation ﻿

In-line 3D AFM for critical dimension and sidewall roughness of Si photonic waveguide and correlation with its propagation loss ﻿

In-line metrology for atomic resolution local height variation ﻿

In-line atomic resolution local nanotopography variation metrology for CMP process ﻿

Design and pitch scaling for affordable node transition and EUV insertion scenario ﻿

EUV single patterning for logic metal layers: achievement and challenge ﻿

650 V dispersion-free enhancement-mode GaN-on-Si HEMTs processed in a 200 mm CMOS fab ﻿

STBC: Side channel attack tolerant balanced circuit with reduced propagation delay ﻿

Study of SiGe cleaning

LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration

Synthesis of degradable polymers for biomedical applications

Indoor tracking of multiple persons with a 77 GHz MIMO FMCW radar

GPflowOpt: A bayesian optimization library using tensorflow

Thickness and gas permeability properties of PLA and PLA/EVOH/PLA before and after thermoforming into variable tray types

Geïntegreerd STEM-onderwijs in de praktijk

Integrated STEM makes a difference!

How social, natural and applied scientists collide and connect: a story about interdisciplinarity put into practice in Flemish schools

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction Loading

How do student and classroom characteristics affect attitude toward mathematics? A multivariate multilevel analysis

Distinctive behavior of perpendicular magnetic tunnel junctions with size comparable to the electrical switching nucleation

In-line 3D AFM for critical dimension and sidewall roughness of Si photonic waveguide and correlation with its propagation loss

In-line metrology for atomic resolution local height variation

In-line atomic resolution local nanotopography variation metrology for CMP process

Design and pitch scaling for affordable node transition and EUV insertion scenario

EUV single patterning for logic metal layers: achievement and challenge

650 V dispersion-free enhancement-mode GaN-on-Si HEMTs processed in a 200 mm CMOS fab

STBC: Side channel attack tolerant balanced circuit with reduced propagation delay