Recently added

Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications

El-Mekki, Zaid; Radisic, Alex; Philipsen, Harold; Honore, Mia; Slabbekoorn, John; Struyf, Herbert; Arnold, Marco; Fluegel, Alexander; Mayer, Dieter; Shu-Ya Chang, Iris (2017)

Silver nanowire networks: prospects towards printed energy applications

Elen, Ken; Nagels, Steven; Penxten, Huguette; Deferme, Wim; Lutsen, Laurence; Hardy, An; Van Bael, Marlies (2017)

3D Mesh coding with predefined region-of-interest

El Sayeh Khalil, Jonas; Munteanu, Adrian; Lambert, Peter (2017-09)

Rate-distortion optimized wavelet-based irregular mesh coding

El Sayeh Khalil, Jonas; Munteanu, Adrian; Lambert, Peter (2017)

Scalable feature-preserving irregular mesh coding

El Sayeh Khalil, Jonas; Munteanu, Adrian; Denis, L.; Lambert, Peter; Van de Walle, Rik (2017-09)

Forcing epitaxial relationships between GS-MBE MX2 grown layers and commercial substrates

El Kazzi, Salim; Mortelmans, Wouter; Nuytten, Thomas; Radu, Iuliana; Merckling, Clement (2017)

Study of WSe2 Van der Waals epitaxy by plasma-assisted MBE

El Kazzi, Salim; Mortelmans, Wouter; Nuytten, Thomas; Caymax, Matty; Radu, Iuliana; Merckling, Clement (2017)

Efficient energy management for the Internet of Things in smart cities

Ejaz, Waleed; Naeem, Muhammad; Shahid, Adnan; Anpalagan, Alagan; Jo, Minho (2017-01)

Facile photo-flow synthesis of branched poly(butyl acrylate)s

Eckardt, O.; Wenn, Benjamin; Biehl, P.; Junkers, Thomas; Schacher, F.H. (2017)

Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding

Duval, Fabrice; Wang, Teng; Bex, Pieter; Lofrano, Melina; Rebibis, Kenneth June; Sleeckx, Erik; Beyne, Eric; Gerets, Carine (2017)

Proposal for nanoscale cascaded plasmonic majority gates for non-Boolean computation

Dutta, Sourav; Zografos, Odysseas; Gurunarayanan, Surya; Radu, Iuliana; Soree, Bart; Catthoor, Francky; Naeemi, Azad (2017)

Thickness dependence of the resistivity of platinum-group metal thin films

Dutta, Shibesh; Sankaran, Kiroubanand; Moors, Kristof; Pourtois, Geoffrey; Van Elshocht, Sven; Boemmels, Juergen; Vandervorst, Wilfried; Tokei, Zsolt; Adelmann, Christoph (2017-07)

Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process

Dutta, Shibesh; Kundu, Shreya; Wen, Lianggong; Jamieson, Geraldine; Croes, Kristof; Gupta, Anshul; Boemmels, Juergen; Wilson, Chris; Adelmann, Christoph; Tokei, Zsolt (2017)

Highly scaled ruthenium interconnects

Dutta, Shibesh; Kundu, Shreya; Gupta, Anshul; Jamieson, Geraldine; Gomez Granados, Juan Fernando; Boemmels, Juergen; Wilson, Chris; Tokei, Zsolt; Adelmann, Christoph (2017)

Deep gaussian process metamodeling of sequentially sampled non-stationary response surfaces

Dutordoir, Vincent; Knudde, Nicolas; van der Herten, Joachim; Couckuyt, Ivo; Dhaene, Tom (2017-12)

Continuous improvements of defectivity rates in immersion photolithography via functionalized membranes in point-of-use photochemical filtration

D'Urzo, Lucia; Bayana, Hareen; Vandereyken, Jelle; Foubert, Philippe; Wu, Aiwen; Jaber, Jad; Hamzik, James (2017)

imec Publications: Recent submissions

Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications

Silver nanowire networks: prospects towards printed energy applications

3D Mesh coding with predefined region-of-interest

Rate-distortion optimized wavelet-based irregular mesh coding

Scalable feature-preserving irregular mesh coding

Forcing epitaxial relationships between GS-MBE MX2 grown layers and commercial substrates

Study of WSe2 Van der Waals epitaxy by plasma-assisted MBE

Efficient energy management for the Internet of Things in smart cities

Facile photo-flow synthesis of branched poly(butyl acrylate)s

Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding

Proposal for nanoscale cascaded plasmonic majority gates for non-Boolean computation

Thickness dependence of the resistivity of platinum-group metal thin films

Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process

Highly scaled ruthenium interconnects

Deep gaussian process metamodeling of sequentially sampled non-stationary response surfaces

Continuous improvements of defectivity rates in immersion photolithography via functionalized membranes in point-of-use photochemical filtration

Hybrid integration of laser source on silicon photonic integrated circuit for low-cost interferometry medical device

Magnetoelastic spin wave excitation: the role of the demagnetizing field

Micromagnetic simulations of magnetoelastic spin wave excitation in scaled magnetic waveguides

Optical simulation of bifacial silicon solar cells at module level

imec Publications: Recent submissions

Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications ﻿

Silver nanowire networks: prospects towards printed energy applications ﻿

3D Mesh coding with predefined region-of-interest ﻿

Rate-distortion optimized wavelet-based irregular mesh coding ﻿

Scalable feature-preserving irregular mesh coding ﻿

Forcing epitaxial relationships between GS-MBE MX2 grown layers and commercial substrates ﻿

Study of WSe2 Van der Waals epitaxy by plasma-assisted MBE ﻿

Efficient energy management for the Internet of Things in smart cities ﻿

Facile photo-flow synthesis of branched poly(butyl acrylate)s ﻿

Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding ﻿

Proposal for nanoscale cascaded plasmonic majority gates for non-Boolean computation ﻿

Thickness dependence of the resistivity of platinum-group metal thin films ﻿

Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process ﻿

Highly scaled ruthenium interconnects ﻿

Deep gaussian process metamodeling of sequentially sampled non-stationary response surfaces ﻿

Continuous improvements of defectivity rates in immersion photolithography via functionalized membranes in point-of-use photochemical filtration ﻿

Hybrid integration of laser source on silicon photonic integrated circuit for low-cost interferometry medical device ﻿

Magnetoelastic spin wave excitation: the role of the demagnetizing field ﻿

Micromagnetic simulations of magnetoelastic spin wave excitation in scaled magnetic waveguides ﻿

Optical simulation of bifacial silicon solar cells at module level ﻿

Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications

Silver nanowire networks: prospects towards printed energy applications

3D Mesh coding with predefined region-of-interest

Rate-distortion optimized wavelet-based irregular mesh coding

Scalable feature-preserving irregular mesh coding

Forcing epitaxial relationships between GS-MBE MX2 grown layers and commercial substrates

Study of WSe2 Van der Waals epitaxy by plasma-assisted MBE

Efficient energy management for the Internet of Things in smart cities

Facile photo-flow synthesis of branched poly(butyl acrylate)s

Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding

Proposal for nanoscale cascaded plasmonic majority gates for non-Boolean computation

Thickness dependence of the resistivity of platinum-group metal thin films

Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process

Highly scaled ruthenium interconnects

Deep gaussian process metamodeling of sequentially sampled non-stationary response surfaces

Continuous improvements of defectivity rates in immersion photolithography via functionalized membranes in point-of-use photochemical filtration

Hybrid integration of laser source on silicon photonic integrated circuit for low-cost interferometry medical device

Magnetoelastic spin wave excitation: the role of the demagnetizing field

Micromagnetic simulations of magnetoelastic spin wave excitation in scaled magnetic waveguides

Optical simulation of bifacial silicon solar cells at module level