Recently added

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

Kumar, Nitish; Chen, Yukai; Sankatali, Venkateswarlu; Mishra, Subrat; Gupta, Ankur; Singh, Pushpapraj; Catthoor, Francky; Myers, James; Ryckaert, Julien; Biswas, Dwaipayan (2024)

Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding

De Messemaeker, Joke; Van Sever, Koen; Tsau, Yan Wen; Zhang, Boyao; Croes, Kristof; Beyne, Eric (2024)

RF modelling and characterization of TSVs and inductive links of hybrid bonded devices

Sun, Xiao; Su, Chin-Ya; Chen, Shih-Hung; Chew, Soon Aik; Zhang, Boyao; Beyne, Eric (2024)

Methodologies for Characterization of W2W Bonding Strength

Gonzalez, Mario; Vanstreels, Kris; Okudur, Oguzhan Orkut; Iacovo, Serena; Beyne, Eric (2024)

Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers

Chery, Emmanuel; Bhatia, Ritwik; Sundaram, Ganesh; Pinho, Nelson; Beyne, Eric (2024)

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism

Chancerel, Francois; Urban, Peter; Slabbekoorn, John; Halas, Simon; Bravin, Julian; Brems, Steven; Uhrmann, Thomas; Wimplinger, Markus; Phommahaxay, Alain; Beyne, Eric (2024)

Impact of Pitch Scaling on 3D Die-to-Die Interconnects

Pantano, Nicolas; Stucchi, Michele; Van der Plas, Geert; Beyne, Eric (2024)

A 32 Gb/s Full duplex Bi-directional Transceiver with Crosstalk Cancellation for Chiplet Interconnections

Park, Jae-Woo; Pantano, Nicolas; Van Der Plas, Geert; Beyne, Eric; Chun, Jung-Hoon (2024)

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Ji, Xinrui; Du, Leiming; van Zeijl, Henk; Zhang, Guoqi; Derakhshandeh, Jaber; Beyne, Eric (2024)

Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers

Kang, Shuo; Iacovo, Serena; D'have, Koen; Van Huylenbroeck, Stefaan; Okudur, Oguzhan Orkut; Alexeev, Anton; Plach, Thomas; Probst, Gernot; Ding, Taotao; Wimplinger, Markus; Uhrmann, Thomas; De Vos, Joeri; Beyer, Gerald; Beyne, Eric (2024)

Multi-tier die stacking through collective die-to-wafer hybrid bonding.

Kennes, Koen; Lin, Ye; Suhard, Samuel; Bex, Pieter; Cuypers, Dieter H.; Guerrero, Alice; Bumueller, Dennis; Phommahaxay, Alain; Beyer, Gerald; Beyne, Eric (2024)

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm

Lin, Ye; Bex, Pieter; Kennes, Koen; Derakhshandeh, Jaber; Dhakras, Prathamesh; Suhard, Samuel; Gerets, Carine; Dewilde, Sven; Georgieva, Violeta; Jourdain, Anne; Beyer, Gerald; Beyne, Eric (2024)

Real-time video enhancement for the removal of surgical lighting artifacts in computer-assisted orthopedic surgery

Allebosch, Gianni; Vanhees, Matthias; Luong, Hiep; Veelaert, Peter; Booth, Brian (2024)

Large-Signal Characterisation and Analysis of AlN/GaN MISHEMTs on Si with a PAE > 62% at 28 GHz

ElKashlan, Rana; Yadav, Sachin; Khaled, Ahmad; Xiao, Dongping; Kazemi Esfeh, Babak; Yu, Hao; Alian, AliReza; Peralagu, Uthayasankaran; Collaert, Nadine; Parvais, Bertrand (2024)

InAlN/GaN-on-Si HEMTs with an InGaN Back Barrier for mm-Wave Applications

ElKashlan, Rana; Yu, Hao; Peralagu, Uthayasankaran; Yadav, Sachin; Kazemi Esfeh, Babak; Alian, AliReza; Banerjee, Sourish; Xiao, Dongping; Parvais, Bertrand; Collaert, Nadine (2024)

DFT-NEGF transport in 2D channels with semimetal contacts: the influence of doping and bilayers

Duflou, Rutger; Houssa, Michel; Lockhart de la Rosa, Cesar Javier; Kar, Gouri Sankar; Afzalian, Aryan (2024)

Resolving nanoscale composition fluctuations and defects in advanced interconnects: a crucial step to comprehend thin film resistivity.

Fleischmann, Claudia; Uedono, Akira; Scheerder, Jeroen; Soulie, Jean-Philippe; Park, Seongho; Adelmann, Christoph; Tokei, Zsolt (2024)

imec Publications: Recent submissions

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding

RF modelling and characterization of TSVs and inductive links of hybrid bonded devices

Methodologies for Characterization of W2W Bonding Strength

Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism

Impact of Pitch Scaling on 3D Die-to-Die Interconnects

A 32 Gb/s Full duplex Bi-directional Transceiver with Crosstalk Cancellation for Chiplet Interconnections

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers

Multi-tier die stacking through collective die-to-wafer hybrid bonding.

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm

Real-time video enhancement for the removal of surgical lighting artifacts in computer-assisted orthopedic surgery

Large-Signal Characterisation and Analysis of AlN/GaN MISHEMTs on Si with a PAE > 62% at 28 GHz

InAlN/GaN-on-Si HEMTs with an InGaN Back Barrier for mm-Wave Applications

DFT-NEGF transport in 2D channels with semimetal contacts: the influence of doping and bilayers

Resolving nanoscale composition fluctuations and defects in advanced interconnects: a crucial step to comprehend thin film resistivity.

Cryogenic Temperature Effects on 16nm FinFet Performance and Mismatch

Adsorption-Based Electrochemical Sensor Design for the Aqueous Detection of Paracetamol

Study of the Magnetoelectric Effect in PVDF/Ni Composites

imec Publications: Recent submissions

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology ﻿

Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding ﻿

RF modelling and characterization of TSVs and inductive links of hybrid bonded devices ﻿

Methodologies for Characterization of W2W Bonding Strength ﻿

Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers ﻿

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism ﻿

Impact of Pitch Scaling on 3D Die-to-Die Interconnects ﻿

A 32 Gb/s Full duplex Bi-directional Transceiver with Crosstalk Cancellation for Chiplet Interconnections ﻿

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering ﻿

Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers ﻿

Multi-tier die stacking through collective die-to-wafer hybrid bonding. ﻿

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm ﻿

Real-time video enhancement for the removal of surgical lighting artifacts in computer-assisted orthopedic surgery ﻿

Large-Signal Characterisation and Analysis of AlN/GaN MISHEMTs on Si with a PAE > 62% at 28 GHz ﻿

InAlN/GaN-on-Si HEMTs with an InGaN Back Barrier for mm-Wave Applications ﻿

DFT-NEGF transport in 2D channels with semimetal contacts: the influence of doping and bilayers ﻿

Resolving nanoscale composition fluctuations and defects in advanced interconnects: a crucial step to comprehend thin film resistivity. ﻿

Cryogenic Temperature Effects on 16nm FinFet Performance and Mismatch ﻿

Adsorption-Based Electrochemical Sensor Design for the Aqueous Detection of Paracetamol ﻿

Study of the Magnetoelectric Effect in PVDF/Ni Composites ﻿

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding

RF modelling and characterization of TSVs and inductive links of hybrid bonded devices

Methodologies for Characterization of W2W Bonding Strength

Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism

Impact of Pitch Scaling on 3D Die-to-Die Interconnects

A 32 Gb/s Full duplex Bi-directional Transceiver with Crosstalk Cancellation for Chiplet Interconnections

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers

Multi-tier die stacking through collective die-to-wafer hybrid bonding.

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm

Real-time video enhancement for the removal of surgical lighting artifacts in computer-assisted orthopedic surgery

Large-Signal Characterisation and Analysis of AlN/GaN MISHEMTs on Si with a PAE > 62% at 28 GHz

InAlN/GaN-on-Si HEMTs with an InGaN Back Barrier for mm-Wave Applications

DFT-NEGF transport in 2D channels with semimetal contacts: the influence of doping and bilayers

Resolving nanoscale composition fluctuations and defects in advanced interconnects: a crucial step to comprehend thin film resistivity.

Cryogenic Temperature Effects on 16nm FinFet Performance and Mismatch

Adsorption-Based Electrochemical Sensor Design for the Aqueous Detection of Paracetamol

Study of the Magnetoelectric Effect in PVDF/Ni Composites