Recently added

Latent heat loss of a virtual thermal manikin for evaluating the thermal performance of bicycle helmets

Mukunthan, Shriram; Vleugels, Jochen; Huysmans, Toon; De Bruyne, Guido (2019)

Non-destructive in-line IMC thickness measurement using acoustic metrology

Mukundhan, Priya; Hou, Lin; Derakhshandeh, Jaber; Liebens, Maarten (2019)

Threshold voltage variations in semi-vertical GaN-on-Si FETs: A comprehensive study

Mukherjee, Kalparupa; Borga, Matteo; Ruzzarin, Maria; Stoffels, Steve; Geens, Karen; Liang, Hu; Decoutere, Stefaan; Meneghesso, Gaudenzio; Zanoni, Enrico; Meneghini, Matteo (2019)

Localized power spectral density analysis on atomic force microscopy images for advanced patterning applications

Moussa, Alain; Saib, Mohamed; Paolillo, Sara; Lazzarino, Frederic; Illiberi, Andrea; Maes, Jan; Deng, Shaoren; Charley, Anne-Laure; Leray, Philippe (2019)

The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay

Mouraille, Orion; van Haren, Richard; Steinert, Steffen; D'have, Koen; Van Dijk, Leon; Hermans, Jan; Beyer, Dirk (2019)

Preferential in-plane alignment, twinning and strain in hetero- and homo-epitaxial growth of 2D selenides

Mortelmans, Wouter; Nalin Mehta, Ankit; Balaji, Yashwanth; El Kazzi, Salim; Vanhaeren, Danielle; Conard, Thierry; Meersschaut, Johan; Nuytten, Thomas; De Gendt, Stefan; Heyns, Marc; Merckling, Clement (2019)

Peculiar alignment and strain behavior of 2D WSe2 monolayers grown by van der Waals epitaxy on engineered sapphire surfaces

Mortelmans, Wouter; El Kazzi, Salim; Nalin Mehta, Ankit; Vanhaeren, Danielle; Conard, Thierry; Meersschaut, Johan; Nuytten, Thomas; De Gendt, Stefan; Heyns, Marc; Merckling, Clement (2019)

Atom probe of GaN/AlGaN heterostructures: the role of electric field, sample crystallography and laser excitation on quantification

Morris, Richard; Cuduvally, Ramya; Melkonyan, Davit; Zhao, Ming; van der Heide, Paul; Vandervorst, Wilfried (2019)

A 160Gb/s (4x40) WDM O-band Tx subassembly using a 4-ch array of slicon rings co-packaged with a SiGe BiCMOS IC driver

Moralis-Pegios, M.; Pitris, S.; Alexoudi, T.; Terzenidis, N.; Ramon, Hannes; Lambrecht, Joris; Bauwelinck, Johan; Yin, Xin; Ban, Yoojin; De Heyn, Peter; Van Campenhout, Joris; Lamprecht, T.; Lehnman, A.; Pleros, N. (2019)

DSP-free 52km-long dispersion un-compensated optical link employing a 40 Gb/s O-band silicon microring modulator assembled with a 1V-CMOS driver

Moralis-Pegios, M.; Pitris, S.; Alexoudi, T.; Ramon, Hannes; Yin, Xin; Bauwelinck, Johan; Ban, Yoojin; De Heyn, Peter; Van Campenhout, Joris; Pleros, N. (2019)

52 km-long transmission link using a 50 Gb/s O-band silicon microring modulator co-packaged with a 1V-CMOS driver

Moralis-Pegios, M.; Pitris, S.; Alexoudi, T.; Ramon, Hannes; Yin, Xin; Bauwelinck, Johan; Ban, Yoojin; De Heyn, Peter; Van Campenhout, Joris; Pleros, N. (2019-08)

Multilayer architecture model for mobile cloud computing paradigm

Mora, H.; Gimeno, F.J.M.; Signes-Pont, M.T.; Volckaert, Bruno (2019)

Design and fabrication of CMOS-based neural probes for large-scale electrophysiology

Mora Lopez, Carolina; Andrei, Alexandru; Wang, Shiwei; Van Hoof, Rita; Severi, Simone; Van Helleputte, Nick (2019)

Unraveling the brain with high-density CMOS neural probes: tackling the challenges of neural interfacing

Mora Lopez, Carolina (2019)

Using SCHC for an optimized protocol stack in multimodal LPWAN solutions

Moons, Bart; Karaagac, Abdulkadir; Haxhibeqiri, Jetmir; De Poorter, Eli; Hoebeke, Jeroen (2019-04)

Performing smart cities research based on existing datasets: a methodology framework

Montero, Eladio; Lievens, Bram; Heyman, Rob; Ballon, Pieter (2019)

Pre-learning vocabulary before viewing captioned video: an eye-tracking study

Montero Perez, Maribel (2019)

Technology-enhanced listening: how does it look and what can we expect?

Montero Perez, Maribel (2019)

Structural analysis and resistivity measurements of InAs and GaSb fins on 300 mm Si for vertical (T)FET

Mols, Yves; Bogdanowicz, Janusz; Favia, Paola; Lagrain, Pieter; Guo, Weiming; Bender, Hugo; Kunert, Bernardette (2019)

Advances in 3D thin-film Li-ion batteries

Moitzheim, Sebastien; Put, Brecht; Vereecken, Philippe (2019)

imec Publications: Recent submissions

Latent heat loss of a virtual thermal manikin for evaluating the thermal performance of bicycle helmets ﻿

Non-destructive in-line IMC thickness measurement using acoustic metrology ﻿

Threshold voltage variations in semi-vertical GaN-on-Si FETs: A comprehensive study ﻿

Localized power spectral density analysis on atomic force microscopy images for advanced patterning applications ﻿

The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay ﻿

Preferential in-plane alignment, twinning and strain in hetero- and homo-epitaxial growth of 2D selenides ﻿

Peculiar alignment and strain behavior of 2D WSe2 monolayers grown by van der Waals epitaxy on engineered sapphire surfaces ﻿

Atom probe of GaN/AlGaN heterostructures: the role of electric field, sample crystallography and laser excitation on quantification ﻿

A 160Gb/s (4x40) WDM O-band Tx subassembly using a 4-ch array of slicon rings co-packaged with a SiGe BiCMOS IC driver ﻿

DSP-free 52km-long dispersion un-compensated optical link employing a 40 Gb/s O-band silicon microring modulator assembled with a 1V-CMOS driver ﻿

52 km-long transmission link using a 50 Gb/s O-band silicon microring modulator co-packaged with a 1V-CMOS driver ﻿

Multilayer architecture model for mobile cloud computing paradigm ﻿

Design and fabrication of CMOS-based neural probes for large-scale electrophysiology ﻿

Unraveling the brain with high-density CMOS neural probes: tackling the challenges of neural interfacing ﻿

Using SCHC for an optimized protocol stack in multimodal LPWAN solutions ﻿

Performing smart cities research based on existing datasets: a methodology framework ﻿

Pre-learning vocabulary before viewing captioned video: an eye-tracking study ﻿

Technology-enhanced listening: how does it look and what can we expect? ﻿

Structural analysis and resistivity measurements of InAs and GaSb fins on 300 mm Si for vertical (T)FET ﻿

Advances in 3D thin-film Li-ion batteries ﻿