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Continued scalability of copper/low-k interconnects

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorCarbonell, Laure
dc.contributor.authorVanstreels, Kris
dc.contributor.authorIacopi, Francesca
dc.contributor.authorD'Haen, Jan
dc.contributor.authorZhang, Wenqi
dc.contributor.authorTravaly, Youssef
dc.contributor.authorDemuynck, Steven
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T00:51:10Z
dc.date.available2021-10-16T00:51:10Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10162
dc.sourceIIOimport
dc.titleContinued scalability of copper/low-k interconnects
dc.typeOral presentation
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.source.peerreviewno
dc.source.conferenceMRS Spring Symposium B: Materials, Technology, and Reliability of Advanced Interconnects
dc.source.conferencedate28/03/2005
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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