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Filling of 80nm trenches using a novel copper oxide reduction and reflow approach

dc.contributor.authorCarbonell, Laure
dc.contributor.authorPalmans, Roger
dc.contributor.authorTravaly, Youssef
dc.contributor.authorTokei, Zsolt
dc.contributor.authorJonas, Alain M.
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T00:52:29Z
dc.date.available2021-10-16T00:52:29Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10176
dc.sourceIIOimport
dc.titleFilling of 80nm trenches using a novel copper oxide reduction and reflow approach
dc.typeProceedings paper
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.beginpage321
dc.source.endpage326
dc.source.conferenceAdvanced Metallization Conference 2004
dc.source.conferencedate19/10/2004
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec
imec.internalnotesConference Proceedings AMC XX


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