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The detrimental effect of a passivation on the electromigration lifetime of narrow Al-Si-Cu lines
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Authors
Witvrouw, Ann
;
Roussel, Philippe
;
Deweerdt, Bruno
;
Maex, Karen
Conference
Materials Reliability in Microelectronics V
Title
The detrimental effect of a passivation on the electromigration lifetime of narrow Al-Si-Cu lines
Publication type
Proceedings paper
Embargo date
9999-12-31
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