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The detrimental effect of a passivation on the electromigration lifetime of narrow Al-Si-Cu lines

dc.contributor.authorWitvrouw, Ann
dc.contributor.authorRoussel, Philippe
dc.contributor.authorDeweerdt, Bruno
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-09-29T13:26:28Z
dc.date.available2021-09-29T13:26:28Z
dc.date.issued1995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1023
dc.sourceIIOimport
dc.titleThe detrimental effect of a passivation on the electromigration lifetime of narrow Al-Si-Cu lines
dc.typeProceedings paper
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorDeweerdt, Bruno
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage447
dc.source.endpage452
dc.source.conferenceMaterials Reliability in Microelectronics V
dc.source.conferencedate17/04/1995
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesMRS Symposium Proceedings; Vol. 391


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