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A novel methodology for sensing the breakdown location and its application to the reliability study of ultra-thin Hf-silicate gate dielectrics
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Authors
Crupi, Felice
;
Kauerauf, Thomas
;
Degraeve, Robin
;
Pantisano, Luigi
;
Groeseneken, Guido
Issue
8
Journal
IEEE Trans. Electron Devices
Volume
52
Title
A novel methodology for sensing the breakdown location and its application to the reliability study of ultra-thin Hf-silicate gate dielectrics
Publication type
Journal article
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