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Mask and wafer topography effects in immersion lithography

dc.contributor.authorErdmann, Andreas
dc.contributor.authorEvanschitzky, Peter
dc.contributor.authorDe Bisschop, Peter
dc.date.accessioned2021-10-16T01:30:54Z
dc.date.available2021-10-16T01:30:54Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10433
dc.sourceIIOimport
dc.titleMask and wafer topography effects in immersion lithography
dc.typeProceedings paper
dc.contributor.imecauthorDe Bisschop, Peter
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage383
dc.source.endpage394
dc.source.conferenceOptical Microlithography XVIII
dc.source.conferencedate27/02/2005
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; VOl. 5754


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