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Effects of UV-cure on mechanical, physical and electrical properties of microporous SiOC:H dielectric films

dc.contributor.authorIacopi, Francesca
dc.contributor.authorWaldfried, Carlo
dc.contributor.authorAbell, Thomas
dc.contributor.authorGuyer, Eric
dc.contributor.authorEyckens, Brenda
dc.contributor.authorTravaly, Youssef
dc.contributor.authorSajavaara, Timo
dc.contributor.authorGage, David M.
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBerry, Ivan
dc.contributor.authorDauskardt, Reinhold
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T02:15:01Z
dc.date.available2021-10-16T02:15:01Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10630
dc.sourceIIOimport
dc.titleEffects of UV-cure on mechanical, physical and electrical properties of microporous SiOC:H dielectric films
dc.typeOral presentation
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.conferenceMRS Spring Meeting Symposium B: Materials, Technology and Reliability of Advanced Interconnects
dc.source.conferencedate28/03/2005
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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