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Flip chip mounting for improved thermal management of AlGaN/GaN HFETs

dc.contributor.authorJi, Hangfeng
dc.contributor.authorSarua, A.
dc.contributor.authorKuball, Martin
dc.contributor.authorDas, Johan
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorGermain, Marianne
dc.contributor.authorBorghs, Gustaaf
dc.date.accessioned2021-10-16T02:20:32Z
dc.date.available2021-10-16T02:20:32Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10651
dc.sourceIIOimport
dc.titleFlip chip mounting for improved thermal management of AlGaN/GaN HFETs
dc.typeOral presentation
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorBorghs, Gustaaf
dc.source.peerreviewno
dc.source.conferenceMaterials Research Society (MRS) Fall Meeting Symposium FF: GaN, AlN, InN, and Related Materials
dc.source.conferencedate28/11/2005
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - imec


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