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Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps
Publication:
Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps
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Date
2005-06
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Labie, Riet
;
Ratchev, Petar
;
Beyne, Eric
Journal
Abstract
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1891
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Acq. date: 2025-12-12
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Metrics
Views
1891
since deposited on 2021-10-16
1
last month
Acq. date: 2025-12-12
Citations