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Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps
Publication:
Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps
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Date
2005-06
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Labie, Riet
;
Ratchev, Petar
;
Beyne, Eric
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Views
1892
since deposited on 2021-10-16
1
last month
1
last week
Acq. date: 2026-02-25
Citations