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Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps

dc.contributor.authorLabie, Riet
dc.contributor.authorRatchev, Petar
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T02:41:25Z
dc.date.available2021-10-16T02:41:25Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10730
dc.sourceIIOimport
dc.titleComparison of a Cu UBM versus a Co UBM for Sn flip chip bumps
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage449
dc.source.endpage451
dc.source.conferenceProceeding of the 2005 Electronic Components and Technology conference ECTC '05. Proceedings
dc.source.conferencedate31/05/2005
dc.source.conferencelocationOrlando, FL USA
imec.availabilityPublished - imec


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