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Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers

dc.contributor.authorLimaye, Paresh
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLabie, Riet
dc.contributor.authorRatchev, Petar
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorVerlinden, Bert
dc.date.accessioned2021-10-16T02:56:25Z
dc.date.available2021-10-16T02:56:25Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10784
dc.sourceIIOimport
dc.titleInvestigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage253
dc.source.endpage258
dc.source.conferenceProceedings 15th European Microelectronics and Packaging Conference - EPMC
dc.source.conferencedate12/06/2005
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


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