Authors

Limaye, Paresh; Vandevelde, Bart; Labie, Riet; Ratchev, Petar; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert

Conference

Proceedings 15th European Microelectronics and Packaging Conference - EPMC

Title

Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers

Publication type

Proceedings paper