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Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
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1963 since deposited on 2021-10-16
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Acq. date: 2025-10-24
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Views
1963 since deposited on 2021-10-16
419item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations