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Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
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1967 since deposited on 2021-10-16
1last month
Acq. date: 2025-12-10
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Metrics
Views
1967 since deposited on 2021-10-16
1last month
Acq. date: 2025-12-10
Citations