Publication:
Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
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1968 since deposited on 2021-10-16
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Acq. date: 2026-01-26
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Statistics
Views
1968 since deposited on 2021-10-16
1last month
1last week
Acq. date: 2026-01-26
Citations