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Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers

Date

2005
Proceedings Paper
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dc.contributor.authorLimaye, Paresh
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLabie, Riet
dc.contributor.authorRatchev, Petar
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorVerlinden, Bert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-16T02:56:25Z
dc.date.available2021-10-16T02:56:25Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10784
dc.source.beginpage253
dc.source.conferenceProceedings 15th European Microelectronics and Packaging Conference - EPMC
dc.source.conferencedate12/06/2005
dc.source.conferencelocationBrugge Belgium
dc.source.endpage258
dc.title

Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers

dc.typeProceedings paper
dspace.entity.typePublication
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