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Aggressive scaling of Cu lowk: impact on metrology

dc.contributor.authorMaex, Karen
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorIacopi, Francesca
dc.contributor.authorVanstreels, Kris
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorD'Haen, Jan
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-16T03:10:10Z
dc.date.available2021-10-16T03:10:10Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10828
dc.sourceIIOimport
dc.titleAggressive scaling of Cu lowk: impact on metrology
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.source.peerreviewno
dc.source.beginpage475
dc.source.endpage481
dc.source.conferenceCharacterization and Metrology for ULSI Technology
dc.source.conferencedate14/03/2005
dc.source.conferencelocationRichardson, TX USA
imec.availabilityPublished - imec
imec.internalnotesAIP Conference Proceedings; Vol. 788


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