Show simple item record

Minimizing plasma damage and in situ sealing of ultra low-k dielectric films by using of oxygen free fluorcarbon plasma

dc.contributor.authorMannaert, Geert
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBoullart, Werner
dc.contributor.authorVanhaelemeersch, Serge
dc.date.accessioned2021-10-16T03:14:12Z
dc.date.available2021-10-16T03:14:12Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10843
dc.sourceIIOimport
dc.titleMinimizing plasma damage and in situ sealing of ultra low-k dielectric films by using of oxygen free fluorcarbon plasma
dc.typeProceedings paper
dc.contributor.imecauthorMannaert, Geert
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.beginpage182
dc.source.endpage184
dc.source.conferenceProceedings 6th International Conference on Microelectronics and Interfaces
dc.source.conferencedate21/03/2005
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record