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Electromigration study of sub-100nm Cu-lines

dc.contributor.authorMichelon, Julien
dc.contributor.authorBruynseraede, Christophe
dc.contributor.authorTio Castro, David
dc.contributor.authorRoussel, Philippe
dc.contributor.authorHoofman, Romano
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T03:27:24Z
dc.date.available2021-10-16T03:27:24Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10890
dc.sourceIIOimport
dc.titleElectromigration study of sub-100nm Cu-lines
dc.typeProceedings paper
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorHoofman, Romano
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecHoofman, Romano::0000-0001-8740-104X
dc.source.peerreviewno
dc.source.beginpage2532
dc.source.endpage257
dc.source.conferenceAdvanced Metallization Conference 2004 - AMC
dc.source.conferencelocation
imec.availabilityPublished - imec
imec.internalnotesConference Proceedings AMC; XX


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