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dc.contributor.authorRichard, Olivier
dc.contributor.authorIacopi, Francesca
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBender, Hugo
dc.date.accessioned2021-10-16T04:31:35Z
dc.date.available2021-10-16T04:31:35Z
dc.date.issued2005-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11105
dc.sourceIIOimport
dc.titleDamage layer in silica-based low-k material induced by the patterning plasma process studied by energy-filtered TEM
dc.typeProceedings paper
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBender, Hugo
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.source.peerreviewno
dc.source.beginpage347
dc.source.endpage350
dc.source.conferenceMicroscopy of Semiconducting Materials. Proceedings of the 14th Conference
dc.source.conferencedate11/04/2005
dc.source.conferencelocationOxford UK
imec.availabilityPublished - imec
imec.internalnotesSpringer Proceedings in Physics; Vol. 107


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